June 19, 2008 – Samsung Electronics and Siltronic AG have begun operations of their 300mm wafer-making JV in Singapore, Siltronic Samsung Wafer Pte. Ltd., 18 months after construction began and two years after its formation. Monthly capacity is targeted at 300,000 wafers/month by 2010, with an overall investment of $1B.
“Siltronic Samsung Wafer’s ability to complete this new plant on schedule and in record time underscores the joint venture’s engineering expertise and the outstanding collaborative strength between Samsung Electronics and Siltronic,” said Siltronic CEO Wilhelm Sittenthaler, in a statement. Oh-Hyun Kwon, president of Samsung Electronics’ semiconductor business division, also noted strong local support from Singapore’s Economic Development board.
The Nikkei daily added that this is Samsung’s first wafer production site outside South Korea, supplying the company’s own needs as well as customers in the US, Japan, and Europe.