June 16, 2008 – Unisem Berhad and subsidiary Unisem-Advantpack Technologies (UAT) have agreed to license FlipChip International’s wafer bumping and wafer-level packaging technologies, in exchange for a stake in UAT. The deal is seen as expanding Unisem’s technology offerings, while broadening FlipChip’s customer reach.
FlipChip says its wafer bumping technology targets fine-pitch devices (including 0.125mm pitch densities). Its Spheron technology, part of this licensing deal, is designed for high-frequency RF wafer-level chipscale packaging and incorporates a new dielectric material to improve electrical and mechanical performance.
“This agreement comes at an ideal time, as the global demand for flip-chip and wafer-level packaging continues to grow significantly in market share due to the substantial cost savings, device size reduction and increased performance benefits,” said Bob Forcier, president and CEO of FlipChip International, in a statement.