Wafer Scanner for Bump Metrology

The WS 3840, Rudolph Technologies’ latest addition to the Wafer Scanner product family for inspection and metrology, integrates the company’s laser triangulation technology for 3D bump metrology and sensitive 2D image-based macro defect inspection on the same wafer handler platform that is used by all of its advanced inspection and metrology tools. Laser triangulation reportedly allows for fast and accurate measurement of bump height and coplanarity.

A time delay integration (TDI) line scan camera provides image-based macro defect inspection for wafer surface and bump, and measures 2D bump characteristics, such as diameter, shape and placement accuracy. High-resolution color imaging is also available for defect review and classification. Rudolph’s inspection platform can handle 200 and 300 mm wafers, and combines fast robots and intelligent scheduling capabilities to maximize handling throughput. Automatic defect classification, sophisticated analytical routines and comprehensive reporting extract actionable information from the massive data stream.The system imports and exports wafer maps in all major data formats to facilitate offline defect review. Rudolph Technologies, Inc. Flanders, NJ, www.rudolophtech.com

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