(July 24, 2008) MANCHESTER, NH — J P Sercel Associates (JPSA) and DynTest Technologies of Grassau, Germany, have entered into a collaborative partnership reportedly to develop and manufacture high-precision scriber / breaker solutions for wafer singulation. DynTest specializes in precise, accurate, and efficient breaking systems, while JPSA specializes in high-speed, high-accuracy laser workstations for wafer scribing.
According to Rick Slagle, sales and marketing director of JPSA, the synergies between the two companies technologies are the driving force behind the collaboration. JPSA’s laser scribing systems reportedly deliver a narrow kerf of 2.5 µm at high speed, which, when combined with Dynatest’s breaking capabilities is expected to allow thicker material to be singulated accurately. Slagle says this means less scribing time, higher throughput and higher yields.
“These systems can break very small, relatively thick VCSEL and HB-LED dies” Slagle added. Wafers with backside metallization, III-V wafers, ceramic substrates and comparable brittle materials can also be processed.
“This provides the industry new opportunities for traceable device singulation in high volume manufacturing.” noted Joerg Lindner and Helge Luesebrink, managing directors of DynTest Technologies.