The Z-Socket, or impedance socket, from Antares, is an RF QFN test socket developed to combine the reliability of traditional spring-probe technology with the impedance-matching functionality of shorter interconnects at higher price points. The Z-Socket uses spring probes to accommodate variable or warped packages better than shorter interconnects that generally can’t establish co-planarity with warped packages. By combining spring probes with an impedance-matching system, signal-integrity performance equal to that of sockets with conductive elastomer or offset stamping contactors has reportedly been achieved.

The Z-Socket is said to achieve impedance of 50 Ohms via a proprietary impedance-matching system that optimizes the diameter, length, and material properties of the spring-probe contacts and composition and location of the ground block in ceramic PEEK housing. Antares’ patent-pending system centers on embedding the spring probes into the copper ground block to connect the ground pad of the QFN package to the PCB. The impedance-matching system can reportedly be fine-tuned to meet various impedance requirements, including 75 Ohms.

The Z-Socket will be showcased at SEMICON West, booth #7211, West Hall, Level 1. Antares Advanced Test Technologies Vancouver, WA, www.antares-att.com