The ITC59200 test measurement unit (TMU), from Integrated Technology Corp. is designed to provide two test functions: die attach and forward bias safe operating area (FBSOA). Die attach testing is performed to detect voids under the die and other types of device construction flaws that could affect the lifetime and safe operating area SOA of the device. The FBSOA non-destructive test is used to determine the SOA of the device, which is defined as the voltage and current conditions at which the device is expected to operate without damaging it.
The ITC59200 TMU is the second in a series of measurement units that run in the ITC59000 test platform. Up to four TMU’s can be installed in the ITC59000 for true parallel device testing and these can be a combination of the new ITC59200 and the ITC59100 Gate Charge/Gate Resistance TMU introduced in 2007.
The ITC59200 ITC will be introduced at Semicon West, Booth #7137. West Hall, Level 1.
Integrated Technology Corp. Tempe, AZ www.inttechcorp.com