Designed for ultra-thin wafer handling, especially for back-end inspection, the NWL200 Series of wafer loaders from Nikon Instruments is said to be capable of loading wafers as thin as 100 &#181m. A chuck system to transfer wafers, an optimized arrangement of sensor beams that allow for accurate detection of wafer shape, and an optional edge-chipping detection function that automatically detects wafer cracking reportedly allows macro inspections of all areas, with added support needed to handle next-generation semiconductor wafers.

Operability features include wafer-slot buttons on the front panel for easy selection of a specific wafer and a large LCD that allows the operator to set conditions and check operating status at a glance. Additionally, when the loader is connected to a LAN, users are able to program recipes and backup data from a PC. Nikon Instruments, Inc. Melville, NY. www.nikoninstruments.com