Cooling High-power Packages

BY KAVEH AZAR, Ph.D. Advanced Thermal Solutions

Higher frequency signal processing and limits on the passage of electrons through metallic media have forced the electronics industry to use smaller component packages. But high-power dissipation from smaller packaging creates heat fluxes beyond conventional cooling technologies. Engineers must cool these devices at either the package or system level. These challenges must be addressed by designers when choosing or developing successful solutions.

Take, for instance, power and frequency. Device power dissipation as a function of frequency and number of gates is shown below:

    Power Dissipation (W) ~ Switching Power


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