SEMICON Europa’s Advanced Packaging Conference Shifts Focus from TSV to WLP

August 5, 2008 &#151 Shifting away from focus on 3D IC and TSV processes, this year’s Advanced Packaging Conference at SEMICON Europa, titled “Technologies, Manufacturing and Supply Chain”, will focus on more immediate issues facing the back-end sector of the semiconductor industry. The conference takes place on October 9 and 10, 2001 in Stuttgart, Germany as part of the SEMICON Europa program.
Eef Bagerman, general manager operations, back-end innovation, NXP Semiconductors offered some insight about how the program was selected, and what technologies will be most likely to spark discussion.

Developed in collaboration with IMAPS, and co-sponsored by Advanced Packaging magazine, the two-day conference will be divided into two sessions: “Advanced Manufacturing, Processes & Materials” and “Embedded Die & Wafer-level Packaging”; and will feature an executive round table, “Wafer Level Packaging & Embedded Die Supply Chain &#151 Who Will Do It?” moderated by Fran

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