(August 31, 2008) SINGAPORE— STATS ChipPAC Ltd. and Infineon Technologies have signed a second agreement in which STATS ChipPAC will provide manufacturing services for products based on Infineon’s first generation embedded wafer-level ball grid array (eWLB) technology. This agreement between the two companies closely follows the Aug. 7 release announcing an agreement between Infineon, STMicroelectronics and STATS ChipPAC on joint development of next generation eWLB technology.
Market demand for complex and power efficient semiconductor devices within a continuously shrinking package footprint is increasingly constrained by the lack of physical pad connection space. Infineon, a supplier of semiconductor and system solutions, has reportedly developed and introduced a fan out wafer level packaging technology, eWLB, that alleviates these constraints. Manufacturing services for the eWLB will be located at STATS ChipPAC’s operation in Yishun, Singapore.
“Infineon introduced the first generation of eWLB in 2007 as a dynamic technology that offered small package dimensions, improved electrical and thermal performance, and maximum connection density for wireless applications,” said Wah Teng Gan, V.P. assembly and test at Infineon Asia Pacific. “Our manufacturing partnership with STATS ChipPAC ensures we will be able to expand the number of highly integrated wafer level packages manufactured with eWLB technology.”
According to Han Byung Joon, Ph.D. executive V.P. and CTO of STATS ChipPAC. eWLB offers a high performance, power efficient solution for the wireless market. He says the partnership with Infineon aligns with the company’s focus on leading-edge integration technology. “With our extensive manufacturing expertise in advanced integration technology, we are looking forward to working with Infineon to achieve volume production of this revolutionary packaging technology.” stated Joon.