(August 7, 2008), GENEVA, SINGAPORE, and NEUBIBERG, Germany — STMicroelectronics, STATS ChipPAC, and Infineon Technologies AG have signed an agreement to jointly develop the next-generation of embedded wafer-level ball grid array (eWLB) technology, based on Infineon’s first-generation technology, for use in manufacturing future-generation semiconductor packages.
The new R&D effort, for which the resulting IP will be owned by the three companies, will focus on using both sides of a reconstituted wafer to create semiconductor devices that have a higher integration level and a greater number of contact elements. The intention of the agreement, according to a statement from all three companies, is to exploit the potential of Infineon’s existing eWLB packaging technology, which has been licensed by Infineon to ST and STATS ChipPAC.
eWLB technology uses a combination of traditional front- and back-end semiconductor manufacturing techniques with parallel processing of all the chips on the wafer. This, together with the increased level of integration of the silicon’s overall protective package, in addition to a higher number of external contacts, reportedly means the technology can provide significant cost and size benefits for makers of cutting-edge wireless and consumer products.
According to Carlo Cognetti, director, advanced packaging technology, STMicroelectronics, the technology complements ST’s next-generation products, especially in wireless. “The eWLB technology sets new milestones in innovation, cost competitiveness and dimensions,” said Cognetti.” We believe that, together with Infineon, we will pave the way to a new powerful package technology platform.” The intention is to use the technology in several products of its ST-NXP wireless joint venture and in other application markets, with first samples expected by the end of 2008 and production by early 2010.
Wah Teng Gan, V.P. of Assembly & Test at Infineon Asia Pacific says the company is pleased to have been selected by ST, and considers the partnership to be recognition of the technology’s potential. “With ST as a new partner, and furthermore STATS ChipPAC as a well-known leader in 3D packaging solutions acknowledging our technology, we see a shift in the packaging industry towards the energy efficient and high-performance eWLB technology,” he predicted.
“We are very pleased that Infineon and ST have selected STATS ChipPAC as a joint development partner to develop the next generation of eWLB technology and to manufacture products on both generations of eWLB technology,” said Han Byung Joon, Ph.D., Executive V. P. and CTO, STATS ChipPAC. “The depth of technical expertise at Infineon and ST, combined with the knowledge we have on driving integration technology and flexibility at the silicon level, are essential to delivering this breakthrough technology.”