SUSS MicroTec uncrates wafer bonders for advanced MEMS

August 27, 2008: SUSS MicroTec, a supplier of process and test solutions for the semiconductor industry, announced the CB Series semi- and fully automated wafer bonders, for advanced MEMS devices used in automotive and consumer applications.

There are a variety of wafer-level bonding methods for MEMS fabrication processes, like anodic and glass frit, with the most commonly used in advanced MEMS being eutectic, fusion, and metal diffusion bonding. Suss says its new CB series wafer bonders, designed for metal bonding applications that require high temperature and high force, meet the most challenging wafer level encapsulation and integration needs for MEMS.

CB technology features bond force to 90kN and temperatures to 600°C along with precision temperature and pressure control for unrivaled process uniformity. These features enable significant die size and cost reduction for MEMS devices.

To meet the demanding alignment needs of advanced MEMS manufacturing, SUSS MicroTec is releasing the BA200 Gen2, a high-precision alignment system, to complement the CB series. And recipes developed on the CB8 semi-automated wafer bonder can be transferred to the CBC200 multi-chamber cluster tools for a smooth transition from the lab or low-volume production to full production.


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