Automatic Wire Bond Inspection System

Viscom’s S6053BO-V wire bond AOI system was conceived specifically for small wire bond analysis. Both the camera technology and transport can be adapted for varying production demands. A universal, high-resolution VHR camera module make it possible to inspect down to a resolution of 2 to 5&#181m/pixel. The camera module can be arrayed with one or several cameras and specialized illumination units, allowing for 100% inspection of bond wires smaller than 20 5&#181m/pixel in diameter.

If faster cycle times are required, the S6053BO-V machine is available in a dual track configuration, which includes an integrated shuttle that loads the second track as inspection is conducted on the first track. Configured for extremely fine bond wire analyses, it can also be used wherever small structures must be resolved with precise accuracy. This opens up the inspection scope to include components and ASICs, as well as classical inspection tasks associated with die and wire bonds. Viscom USA Atlanta, GA; www.viscom.com

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