Indium9.32 Die-attach Solder Paste is a halogen-free, no-clean, die-attach solder paste used in high-volume manufacturing for lead-free die-attach applications. Formulated to leave a benign, invisible residue, it is designed for reflow in forming gas. This product is said to have superior wetting capabilities, and offers trouble-free probe testing. Low voiding, as well as ultra-low residue makes it compatible with a variety of molding compounds. Indium9.32 reportedly meets or surpasses all ANSI/J-STD-004, -005 specifications and Bellcore Electromigration test criteria. Formulated to be applied using automated high-speed, high-reliability, single pointor multi-point dispensing equipment, it will also function in hand held applications. Indium Corp. Utica, NY, www.indium.com