Microlithographic Polymer Films

DuPont PerMx Series 3000 is a new version of permanent microlithographic polymer films designed for applications such as redistribution, bonding, and structuring. This multi-purpose film features high resolution, low-temperature cure and reportedly outstanding mechanical properties. These films are available in 10, 15 and 20&3181; thicknesses. It is said to achieve high yield and quality through uniform resist thickness across the entire wafer. There is no need for drying or double coating and no edge bead removal. Additionally, it has the ability to conform and tent over pre-formed features.

Other features include low temperature curing, low shrinkage and outgassing, and adheres to both silicon and glass. Applications image sensor and cavity packaging, as well as 3D wafer to wafer or chip to wafer bonding applications. DuPont Electronic Technologies Research Triangle Park, NC; www2.dupont.com/Electronics/en_US/

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