(October 22, 2008) SAN JOSE, CA — MEPTEC, the MicroElectronics Packaging and Test Engineering Council, and Advanced Packaging magazine have finalized the program for their upcoming symposium titled “Packaging Developments and Innovations: From System Design to Integrated Delivery” to be held on Thursday, November 13, 2008 at the Wyndham Hotel, San Jose, CA.
The event will begin with a keynote presentation by Glenn Daves, Director of Packaging Technology, Freescale Semiconductors who will discuss “Aligning of Packaging Development with the Market”. There will also be a luncheon keynote presentation given by industry veteran, Mike Crawley regarding, “How to Become Involved in Significant Technological Advances: Being in the Right Place at the Right Time!”
In addition to the keynote presentations, MEPTEC will once again bring together a group of technical speakers who are considered experts in their fields. Sessions and speakers include:
Advanced Packages and Processes
Session Chair: Jim Walker, Gartner Dataquest
Craig Borkowski, Global Director Semiconductor Market Segments, Henkel Corporation – Die Attach Process with Wafer Back Coating
Rozalia Beica, 3D Interconnect Director, Semitool, Inc. – Advances of Through Silicon Via Technology for 3D Vertical Integration
Rick Lathrop, Manager, Applications and Customer Support, Heraeus Inc. – Dippable Solder Paste Applications for PoP Assembly
Packaging to Board Assembly Trends
Session Chair: Gail Flower, Advanced Packaging Magazine
Tim Olson, Senior Vice President, R&D and Emerging Technologies, Amkor Technology – Challenging Applications Driving Package Innovations — Case Study of Solutions in Emerging Technologies
Raj Pendse, Ph.D. V.P. of Emerging Technologies, STATS ChipPAC – Flip Chip Packaging: New Opportunities & Challenges
Gheorghe Pascariu, Director Asia Business Development, Unovis Solutions – High Speed Placement of Wafer Level Devices Using SMT Equipment
Microelectronics Substrate Fabrication and Assembly Innovation
Session Chair: Dale Baird, Sierra Microelectronics
Bernd Appelt, Ph., Director of Worldwide Business Development, ASE (U.S.) Inc. – Substrate Requirements and Options for 4th Generation Flip Chip Packages
Lex Kosowsky, President & CEO, Shocking Technologies – Embedded Electrostatic Discharge (ESD) Solutions
Jan Vardaman, President, TechSearch International – New Packaging Developments and the Impact on Substrates
Design Tools and Co-Design Solutions
Session Chair: Mary Olsson, Gary Smith EDA
Gary Smith, Chief Analyst, Gary Smith EDA – Design Trends 2008
Per Viklund, Director of RF & IC Packaging, Mentor Graphics – Chip-Package-Board Co-Design Solutions for 3D Integration
An-Yu Kuo, Ph.D., Chief Architect, Apache Design Solutions – Chip-Package-System Co-Simulation for Risk Mitigation and Cost Reduction
