High strain-rate bondtesting using the 4000HS is a technique for detecting brittle fracture failures in lead-free materials. The high-speed trigger capture software and rising table work holder for cold bump bondtesting are innovations built into the toolset. Bond failure energy measurements make it possible to detect subtle differences between solder materials, bump metallization, and process parameter changes.
Using energy as a metric, high strain-rate bondtesting becomes a production monitor. Force-displacement curves are generated for each test. Bands of values can be assigned to particular failure modes and correlated with the same failure modes in board-level drop testing. The 4000HS high-speed bondtester provides energy measurements during bondtesting, ensuring full compliance with JEDEC standards. Dage Precision Industries, Inc, Fremont, CA, www.dage-group.com