November 17, 2008: Siimpel Corp., a supplier of optical microelectricalmechanical systems (MEMS)-based solutions for the mobile market, announced today that it has completed an investment round in support of its MEMS technology and product development for mobile camera applications. DOCOMO Capital Inc., the corporate venture arm of NTT DOCOMO, a Japanese wireless carrier, has joined Siimpel’s existing strategic investors from the mobile market, which includes the venture arms of Qualcomm, Motorola, and Micron Technology.
“The addition of DOCOMO Capital to our team further validates the strength and potential of our technology portfolio, particularly given current economic conditions,” said Siimpel CEO Chee Kwan, in a statement. “With this additional funding, we can continue to build on the successful commercial introduction of our first-generation MEMS camera designs, and intensify our product development efforts to accelerate the delivery of the highest-performance, lowest-power, and smallest-size mobile camera designs,” which he said will incorporate high-end DSC functionality enabling auto-focus, shutter, image stabilization, and zoom capabilities.
“We are excited about the potential for Siimpel’s silicon MEMS technology in enabling low-power, high-performance, extremely compact camera modules for mobile handsets ,” added DOCOMO Capital Inc. president/CEO Tomoya Hemmi. “These features will bring greater flexibility in designing handsets, enabling new applications and uses of mobile phone cameras.”
Siimpel’s recent investment round was also supported by several existing investors from leading venture capital firms including Draper Fisher Jurvetson, Portage Venture Partners, Zone Ventures, Scales Venture Partners, and SunAmerica.