Wafer-level CSP Interposers

Synergetix test socket interposers for wafer-level chip scale package (WLCSP) testing are used for vertical probing applications. The interposers have a plastic assembly containing IDI’s semiconductor probe technology built in. Combined with an easy-to-design-and-fabricate load board, interposers require minimal attention throughout their life cycle.

WLCSP interposers have linear compression against the wafer, leading to a long mechanical life. Contact replacements commonly are unnecessary before 500,000 tests with cleaning cycles every 50,000 touchdowns. The interposers are applicable for high-current applications. Interconnect Devices, Inc., Kansas City, KS www.idinet.com

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