The 3D interconnection chip carrier from Microcertec S.A.S 3-D combines precision-grinding of ceramics with thin-film metallization and laser micromachining to create a 3D package option for chips and ICs. Ceramics reportedly offer better heat dissipation, electrical insulation, and dimension stability at extreme temperatures than plastics and metals. This carrier is said to enable reduced package weight and size while assuring precision in positioning the electrode array.

Manufactured from a 3D ceramic body that is fully machined to required shape and tolerances, a thin metal layer is then deposited onto it by vacuum thin-film deposition technology. Finally, laser ablation is used to micro-machine the metal layer, revealing the IC.

When compared with photolithography techniques for 2-D surfaces, laser micromachining is said to enable the manufacturing of monolithic 3D interconnection devices with more flexibility and no expensive tooling. This technology may be a cheaper solution for prototypes and low-quantity batches of 2-D or 2.5-D formats because it only requires NC programming and laser-processing setting. Single parts can be treated and there is usually no need for expensive fixtures. Changing a circuit pattern only requires a programming modification. Microcertec S.A.S; Coll