AlSiC hermetic packaging assemblies from CPS Technologies offer an alternative to traditional thermal management hermetic packaging materials such as CuMo and CuW. The combinations of lightweight, high thermal conductivity, CTE matching, and low cost make it appropriate for applications in which thermal management and/or weight are important.
Unlike CuMo and CuW, which require machining for all but the simplest shapes, many AlSiC designs are cast to the final shape, requiring no secondary machining. The net-shape casting capability reportedly enables the direct creation of functional design features, such as pockets for circulators as well as cavities or pedestals for die.
These hermetic packages will typically be in the form of an AlSiC base or heatsink brazed to a conventional alloy seal ring or hermetic package. The frame includes a matched glass seal to the ASTM F-15 (Kovar) pins. The entire package is hermetic to better than 10-9 atm-cm3/s, and is RoHS compliant. CPS Technologies Norton, MA; www.alsic.com