TSV Etch Tool

The Applied Centura Silvia Etch system from Applied Materials is specifically designed to enable high-performance, low-cost, through-silicon via (TSV) applications. The system’s precise profile control reportedly enables the smooth, vertical via sidewalls that are critical for the subsequent deposition of high-quality liner and fill films. In addition, it can etch both silicon and oxide in the same chamber.

The Silvia system’s performance is achieved with proprietary time-multiplexed gas modulation (TMGM) process. While conventional TMGM processes etch vias with heavily scalloped sidewalls that are difficult to fill, this system is said to achieve smooth, vertical profiles at rapid etch rates. The system’s profile control accommodates both via-first and via-last TSV schemes, each with different challenges. Applied Materials Santa Clara, CA; www.appliedmaterials.com


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