SEMI: 3Q08 worldwide billings down 16 percent from 2Q08

DECEMBER 16, 2008–SAN JOSE, CA–SEMI today reported that worldwide semiconductor manufacturing equipment billings reached $6.56 billion in 3Q08. The billings figure is 16 percent lower than 2Q08 and 41 percent less than the same quarter a year ago. The data is gathered in cooperation with the Semiconductor Equipment Association of Japan (SEAJ) from more than 150 global equipment companies that provide data on a monthly basis.

SEMI also reported worldwide semiconductor equipment bookings of US$5.60 billion in 3Q08, 37 percent less than the same quarter a year ago and 20 percent less than the bookings figure for 2Q08.

See quarterly billings data by region in millions of U.S. dollars, year-over-year and quarter-over-quarter growth rates by region, below.

Note: Figures may not add due to rounding.

Source: SEMI/SEAJ December 2008



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