JANUARY 21, 2009–HAYWARD, CA and HILLSBORO, OR–Ultra Clean Technology (Ultra Clean Holdings, Inc.) and FEI Co. have signed a Global Supplier Agreement under which Ultra Clean will provide hosted manufacturing services in the FEI Hillsboro, OR facility. It is also anticipated that Ultra Clean’s Asia operations will be utilized to produce some FEI subassemblies. The two companies are targeting the first quarter of 2009 for transfer of current product lines to Ultra Clean Technology operations.

Ultra Clean is a developer and supplier of critical subsystems for the semiconductor capital equipment, flat panel, solar, and medical device industries. FEI Co. provides high-resolution imaging and analysis systems.

Ultra Clean will provide turnkey manufacturing for products currently manufactured at FEI’s Oregon facility, as well as new tools currently under development. This includes mechanical and electrical test of several different modules and final integration.

“This agreement is an important part of the restructuring program we announced last spring,” says Brian Pierson, senior vice president, worldwide operations, for FEI. “Our overall goals include material cost reduction, more effective use of our fixed assets, increased flexibility, and currency balance. Working with high-quality partners such as Ultra Clean will help us reach those goals, while FEI focuses its energy on further technology leadership in growing life sciences, research and electronics markets.”

Source: Ultra Clean Technology

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