Via-first or Via-last …a Matter of Perspective

By Chris Sanders, Ziptronix Inc.
The momentum building around 3D IC integration technology over the past few years makes it clear that this technology is going to happen &#151 it’s just a matter of when. There are three main components to 3D IC technology: through silicon via (TSV) formation; thinning; and bonding. The numerous process flows that exist for 3D integration are all related to the sequence in which these three processes occur1.

When it comes to via formation, one of the questions that must be answered is whether to form the TSV before or after the IC is completed

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