Lead-free Thermal Management Material

Honeywell Pb-free Die Attach Solder is a lead-free thermal interface material that is said to effectively manage heat produced by semiconductor chips to improve chip reliability. It is designed to dissipate the heat by filling the gap between the semiconductor and heat spreader.

Demand for lead-free solders is growing, driven in part by regulation. This lead-free material is an advanced technology that is better for the environment, but while still reportedly meeting industry requirements for melting temperature, wetting behavior, and mechanical properties, and particularly resists melting during board-level solder reflow.

Targeting the semiconductor industry’s power device segment, Pb-free Die Attach Solder is suited to a wide range of industries, from automotives to cell phones. It is designed for use in wire form and compliments Honeywell’s large diameter aluminum wire products. Honeywell Electronic Materials Morris Township, NJ www.honeywell.com

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