New Analytical Method Helps Control Hard-to-Measure Contamination

March 15, 2009 — CHASKA, MN — Entegris, Inc. (Nasdaq: ENTG) has introduced a new solution for accurately measuring and controlling volatile organic compounds that cause contamination in advanced semiconductor lithography processes. If left uncontrolled, these low molecular weight, silicon-containing, organic compounds (such as TMS) have been shown to impact 248 nm and 193 nm exposure tools, and can lead to permanent damage of sensitive and costly optical components.

Entegris is is one of a few companies worldwide with analytical services capabilities to accurately sample and analyze these contaminants in the fab environment. Manufacturers of scanner tools have already mandated the measurement of high molecular weight contaminants, but until now, there has been no means for fabs to reliably identify and quantify the presence of the low molecular weight variety. Together with this lab’s ISO 17025 accredited analytical services, Entegris’ filtration and purification products provide solutions that identify, measure, and then control airborne molecular contamination.

“We are now able to accurately and reliably see and control low molecular weight silicon contamination as well as some high molecular weight compounds such as HMDSO and D3, which have been difficult to measure” said J


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