By Francoise von Trapp, contributing editor
3D embedded technologies just got closer to volume manufacturing. We’ve been hearing variations on the embedding theme for quite some time, what with GE’s “chips first” approach newest version, which uses a solderless process called embedded chip build up (ECBU), to achieve high performance capabilities with advanced copper / low-k devices; the Fraunhofer IZM’s chip-in-polymer (CiP) technology moving into the industrialization phase with the Hermes Project; and IMEC’s recent contribution to embedded technologies, the ultra-thin chip package (UTCP), which addresses known good die issues. However, none of these have made it to high volume manufacturing as of yet. However, one embedded solution, Imbera’s integrated module board (IMB) technology appears to be on its way, after the company’s announcement of successful Series B funding, which the company expects will take it into high volume production by Q4 of this year.
Risto Tuominen, co-founder and CTO of Imbera Electronics oversees R&D, and technology licensing, and is responsible for the task of taking IMB into high-volume production. He says it’s well known that the cost of packaging has been increasing over the years. “We believe embedding technology is one of the most powerful solutions,” says Tuoiminen, adding that the success of bringing embedded technologies to volume production is to “keep things very simple”. He says this is what has thus far prevented other embedded processes from breaking out of R&D.
Tuominen’s relationship with IMB technology extends back to his university days and the technology’s earliest version. “The early version worked, but it wasn’t suited to high-volume production,” he explained. The solution was to go back to the drawing board to focus on developing a product geared to high-volume production. Third-generation IMB reportedly does just that.
The process itself (Figure 1) begins with active and passive component attachment to the base substrate, followed by core board stack-up in which the PCB core is built up around the components. The core has copper on both sides. The next step is core pressing and via formation using laser technologies to clean and form vias. Final PCB processing involves plating and pattering. In the final plating process, vias are filled with copper to form the electrical connections, eliminating the need for wire bonds. The process is suited to an assortment of applications from low-cost / low-complexity QFN and BGA type packages (what Imbera has dubbed iQFN, and iBGA); system-in-package modules (SiP) from those that embed actives with few passives, up to more complex configurations such as full-array package on package (PoP) with integrated EMI shielding; to the most complex system-in-mother board (SiB).
Tuominen says the simplicity of the structure lends itself to more freedom in the designs. Thermal issues are virtually nonexistent because thermal vias can be designed into the front and back side of the components to improve heat conductivity. Additionally, the manufacturing process uses standard materials and equipment to enable scalability to high volume at low cost. For example, rather than requiring costly flip chip placement equipment for assembly, a high-speed chip shooter can be used.
With technology solutions firmly in place, Imbera will use this latest round of financing to set up a high-volume manufacturing operation in Sangsong-ri, South Korea, while continuinge its embedded technology evolution into the 4th generation through R&D activities located in Espoo, Finland. Production at the new South Korean facility is scheduled to begin in Q4 2009. Successfully achieving funding in this economy is an achievement to be applauded. Something tells me we’ll be hearing a lot more from this company.
For more on how Imbera plans to take on the supply chain for 3D packaging, visit Francoise in 3D.
Contact Francoise von Trapp