Solder Paste Inspection

CyberOptics Corporation announcesc that it will introduce SE500, an advanced 100 percent 3-D solder paste inspection system, in booth 4E19 at the upcoming NEPCON Exhibition and Conference in Shanghai. The event is scheduled to take place April 21-24 2009 at the Shanghai Everbright Centre.

CyberOptics redefines inspection speed with the SE500

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