The superGRIP heatsink assembly from Advanced Thermal Solutions, Inc. features a heatsink, phase-change interface material, and unique attachment system for mounting onto a wide range of hot -running BGA components. The novel design is said to require minimal space on a PCB and eliminates the need for thru holes in the board.

The two-part superGRIP attachment system features a plastic frame clip that fastens securely around the perimeter of a component, and a metal spring clip that slips through a heatsink’s fin field and locks securely to both ends of the plastic frame. The resulting superGRIP assembly applies steady, firm pressure to the component throughout the product lifecycle, and is said to improve thermal performance and long-term reliability. superGRIP heat sink assemblies are suited for cooling BGAs on densely populated PCBs that have little space around the component for mechanical attachment.

The assemblies feature ATS’ maxiFLOW™ heatsinks, which have a low profile, spread fin architecture to maximize surface area for more effective convection (air) cooling. The company claims it tests at an air flow rate of just 0.5 m/s (100 ft/m), thus showing that device junction temperatures (Tj) can be reduced by more than 20% below the temperatures achieved using heatsinks with traditional fin styles.

The pressure strength and security of the superGRIP heat sink attachment system permits the use of high performance phase-changing thermal interface materials (PCMs) that improve heat transfer by as much as 20 times over typical double-sided adhesive thermal tapes. The superGRIP design allows the heat sink to be detached and reattached without damaging the component or the PCB. Advanced Thermal Solutions Norton, MA. www.qats.com