DEK International has introduced ProFlow Evolution, it’s next-generation ProFlow enclosed print head solution, to expand the system’s capabilities to apply to a variety of applications including traditional solder paste printing, flux deposition, adhesives and encapsulant printing, solder spheres, thermal interface materials, and more.
ProFlow’s enclosed head printing allows for efficient materials transfer which in turn affects throughput rates and process yields, while reducing material consumption and improving process control. In addition to reported environmental and cost saving benefits of lower material waste afforded by the enclosed print head, ProFlow now incorporates the ability to mix and condition materials for uniform performance control. DEK International, Weymouth, UK. www.dek.com