(May 19, 2009) BANNOCKBURN, IL — IPC — Association Connecting Electronics Industries invites researchers, academics, technical experts, and industry leaders to submit abstracts for the 2010 IPC APEX EXPO at Mandalay Bay Resort and Convention Center, Las Vegas, April 6–9, 2010.
IPC APEX EXPO conference and exhibition for the electronic interconnect industry provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives worldwide. To recognize exceptional achievement, awards will be presented for “Best U.S. Paper” for U.S. authors and the “Best International Paper” for authors from outside the United States.
Expert presentations are sought on all relevant electronics design, PCB fabrication and manufacturing topics. Submissions in the areas of package on package assembly, printable electronics, and advanced substrates are especially encouraged.
A 300-word abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted by July 17, 2009. The submission should describe significant results from experiments, emphasize new techniques, discuss trends of interest, and contain a summary of the technical and/or appropriate test results in the final paper.
Proposals are also solicited for full-day and half-day professional development courses on design, printed board, and electronic manufacturing processes and materials.
All abstracts and proposals are due July 17, 2009. To submit an abstract or proposal, visit www.ipcapexexpo.org/call-for-papers. For more information about conference presentations, contact Toya Richardson, IPC technical administrative assistant, at [email protected]. For course proposal information, contact Anne Marie Mulvihill, IPC professional development program manager, at [email protected].