(June 2, 2009) RESEARCH TRIANGLE PARK, NC — The 2009 3D Architectures for Semiconductor Integration and Packaging Conference and Exhibition will bring together industry leaders to examine the practical and competitive landscape on the path to implementation of 3D integration and packaging technologies, December 9 through 11, 2009, in Burlingame, CA.
This conference series, coordinated by RTI International, offers a unique techno-business perspective of the emerging 3D chips commercial opportunity, combining technology with business, research findings with practical insights, to offer industry leaders the information needed to plan and move forward with confidence.
3-D integration and packaging represents a paradigm shift for the semiconductor industry, opening new pathways for advancement and industry growth. The 2009 conference will continue to provide this unique forum dedicated to serving the needs of the entire 3-D community, and will also feature expanded exhibit offerings.
“Industry experts around the world have come to view 3D chips as a key enabler to continued performance improvements and market growth for the semiconductor industry,” said Phil Garrou, conference co-chair. “The challenges inherent in continued scaling in 2D are simply too daunting and only offer incremental improvements in performance, and at higher cost. Industry players who understand the challenges and opportunities, and offer new solutions, will reap the rewards for many years to come.”
For more information, or to register for the 2009 3-D Architectures for Semiconductor Integration and Packaging Conference and Exhibition, visit techventure.rti.org.