Next-generation Underfill System

Specifically designed for use with CSP and BGA devices, Henkel’s Hysol® UF3800, addresses complex and demanding industry requirements including room temperature fast flow, low temperature cure and reworkability. This material is said to be particularly well-suited for handheld communication and entertainment applications.

This novel underfill material reportedly flows fast at room temperature and cures quickly at low temperature, eliminating the need for substrate pre-heat This enables manufacturers to reduce energy costs, eliminate capital equipment expenditure associated with dispensing system heaters, and improve throughput rates. The material is reworkable for improved final yield a and reduction of scrap. Additionally, it is halogen-free and meets the current accepted industry standard of<900 ppm chlorine (Cl) and bromine (Br).

Hysol UF380 is compatible with a variety of lead-free and halogen-free solder pastes, and its unique chemistry offers a relatively high glass transition temperature (Tg) required for improved thermal cycle performance. It also exhibits stable electrical performance under temperature humidity bias (THB); an essential performance metric as devices continue to get smaller and I/O pitches become tighter. Henkel Corp. Irvine, CA;


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