Franklin Kalk, CTO at Toppan Photomasks, tells SST that the industry shouldn’t close off any lithography options until there is certainty that a cost-effective solution is available with which everyone can live. He also discusses the defectivity management needs for EUV and imprint lithography. With respect to EUV readiness, Kalk thinks that it probably won’t be ready for 16nm logic, and that the industry will still be using double-patterning at that node.
Addressing the three current post-32nm lithography prospects, Kalk summarized thusly:
What’s been divined in the past six months is that EUV won’t be ready for the 22nm logic node, and maybe not 16nm either (imprint might be ready by then perhaps for nonvolatile memory). But for now, until there’s a cost-effective solution that’s absolutely sure, all options should be on the table.