(July 28, 2009) DURHAM, NC — Nextreme Thermal Solutions and Lockheed Martin (NYSE: LMT) entered into a cooperation agreement to develop new products based on Nextreme’s thin-film thermoelectric materials. The agreement allows Lockheed Martin to use Nextreme’s thin-film thermoelectric products and thermal and power management design services in solutions it is developing for government and civil applications.
Lockheed will use the partnership to develop differentiated products for enhanced thermal and power management, said Brad Pietras, director of nanotechnology programs at Lockheed Martin. Jesko von Windheim, CEO of Nextreme, referred to Lockheed as a leading-edge technology company with an exceptional channel into the government sector.
Nextreme’s team of engineers offers thermal modeling, design and engineering services to deliver fully optimized microscale thermal and power management solutions using standard and customized products.
Nextreme uses its thermal bump technology to produce discrete and integrated cooling and power generation devices. Nextreme currently offers several thermoelectric coolers, such as the OptoCooler HV14 and UPF40, that are capable of cooling and heating in ranges from 0.4 to 4.0 W, with plans to provide higher heat pumping in the near future.
For more information, visit www.nextreme.com.