Stepping up to the 3D challenge

July 15, 2009 – There is a major push with respect to 3D technology; Soitec is focusing on wafer-wafer integration and 3D packaging with its core technologies of wafer bonding/thinning (Smart Stack) and layer transfer (Smart Cut), as well as metal to metal bonding.

After achieving first commercial success with STMicroelectronics’ image sensors, Soitec also announced this week a collaboration with IBM, providing these bonding/layer transfer technologies for 3D integration.


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