Bart Swinnen, IMEC, Discusses TSVs

In this video interview from SEMICON West 2009, Bart Swinnen, reviews the established interconnect bonding and through-silicon via (TSV) technologies at the system-integration level. He also discusses the newer TSV possibilities and different application-specific TSVs.

Watch Bart Swinnen’s TSV and 3D interconnect interview here.

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