Karen Twillmann, executive director of corporate marketing at Brewer Science, discusses the advances made by the company’s temporary bond adhesive for wafer bond applications:

Dan Wallace, director of 3D packaging at the company, told SST that it is in numerous development projects with end users. “At the same time we’re committed to the continuous improvement and introduction of 3D packaging solutions for the industry,” said Wallace. He noted that the company is focused on three key areas of focus relative to equipment, material and process, as related to temporary waferbond.

The current temporary adhesive, HT10.10, is rated at a 220°C maximum temperature tolerance, said Wallace. “Although in certain applications it can be exposed to much higher temperatures, conservatively we rate it at 220°C.” Recognizing that there is a need for adhesives that can withstand higher temperatures, the company is also engaged in development activity and is in the process to introduce materials capable of up to 300°C by the first quarter of 2010.

In a second area of focus, the company be will be introducing an R&D level high-temp slide debonder to support users who are not ready to invest in production-level equipment. “This will allow the flexibility to perform R&D activity in a confidential setting,” Wallace told SST. The Cee 1300DB has a planned introduction of December 2009 and information is available now.

A third area of focus is applications with solder bumps that require higher temperature tolerant adhesives >220°C. These materials will not tolerate the existing high temperature slide debond process. “We’re in proof of concept developing a patented room-temperature debond process combining the benefits of the thermoplastic adhesive while removing the need to debond at high temperature,” Wallace told SST. Alpha phase is targeted for 2Q10; “we are working with our partner EVG regarding automated equipment design and manufacture,” he said.