How CMP enables innovation in memory, 3D, MEMS

Robert Rhoades, CTO, Entrepix, describes the nontraditional technology behind TFT-dual gate memory and how CMP enables that innovation among others (e.g., TSVs, 3D packaging, MEMS, and engineered substrates).

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.