SMTA webcasts on package on package (PoP), STACK assembly, rework, and inspection

(January 22, 2010) MINNEAPOLIS — The Surface Mount Technology Association (SMTA) will host two 90-minute online sessions with Bob Willis, ASKbobwillis.com, on package-on-package (PoP) applications and implementation. The Webtorials will take place February 4 and February 11, 2010 from 1:00 to 2:30 pm EST.

PoP applications are growing in popularity for mobile and handheld professional electronics applications, placing further demands on assembly engineers. In simple terms, POP represents the stacking of components one on top of another either during the original component manufacture or during printed board assembly. As real estate is at a premium for logic and memory, PCB designers say the only way to go is up and up. PoP packaging systems may include direct soldering, wire bonding, or conductive adhesives for device to device interconnection.

PoP is new to many contract and OEM assembly staff but with the demands of paste dipping, reflow warpage, increased placement accuracy/Z-axis control process introduction can be demanding. The difficulty in multi-level ball inspection can be a challenge for X-ray equipment procedures as level one balls can mask level two and three interconnections. Manual inspection can be used but with these applications space is often not available for side viewing. Each delegate will receive a free set of package on package inspection and quality control wall charts covering optical and X-ray inspection, dip flux and paste application, placement criteria and defects seen during assembly.

This webtorial suits design, production and quality engineers looking at future technology and maintaining a company technology roadmap. It’s vital to subcontractors to be up-to-date with new technology and its possible implementation along with material and equipment requirements for future customers.

Topics include:
What is Package on Package (PoP)?
Benefits of PoP Stack Packages
Component Standards
Component Types
JEDEC Standards
PCB Design Rules
Pad Layout
Via Hole Connection
Lead-Free Assembly
Engineering Interviews
Stencil Printing
POP Placement
Tack Flux
Dip Solder Paste
Reflow Soldering
Convection
Vapor Phase Soldering
Temperature Profiling
Inspection
Optical Inspection
X-ray Inspection
Underfill
Rework
Package on Package Defects

Bob Willis currently operates a training and consultancy business based in England with a large collection of interactive training CDs. A specialist in implementing lead-free manufacture, Willis provides worldwide training and consultancy in most areas of electronic manufacture and design. He has worked for OEM and contract assembly, printed board manufacture and environmental test facilities. This recently earned him the SOLDERTEC Global Lead Free & SMTA International Leadership Award plus IPC Committee Award for his contribution to industry. Willis is a Fellow of the Institute of Circuit Technology and awarded Life Long Vice President of the SMART Group.

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