(January 26, 2010) ATLANTA, GA — Wire bond inspection system maker Viscom introduced software tools for its very high resolution (VHR) camera module, which has the ability to provide exact measurements of balls and wedges. With this technology, 25-µm gold thin-wire wedge sizes can be measured with a standard deviation of 1 µm. In addition to inspecting qualitative characteristics of wire bonds, balls and wedges statistical evaluation and trend analysis of critical geometric dimensions can also be performed in the production process.

Viscom equips its inspection systems with a comprehensive portfolio of algorithms to record geometric values during wirebond inspection. For gold wire bonds with diameters less than 25 µm, the Viscom VHR module’s special illumination enhances geometric features. The VHR module’s resolution of approximately 3 µm per pixel produces standard deviations in wedge widths of 1 µm.

Every change in the bond process can be discovered and any negative trend can be corrected immediately. With this method, Viscom also meets the automotive industry’s requirements of a maximum width tolerance of a few micrometers at 3 σ.

The tool benefits customers with high volume production requirements, as well as small- to mid-volume manufacturers in industries such as aerospace, aviation or medical electronics.

These measurement tools are available for all Viscom wire bond inspections. With help from the statistical process control VPC, measurement data can be pulled up at a moment’s notice and intervention limits defined.

For more information, visit http://www.viscom.com

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