(February 17, 2010) — System Plus Consulting released its new reverse costing analysis of the enhanced Wafer Level BGA (eWLB) packaging used in the X-GOLD 213 circuit from Infineon. eWLB is a ball grid array (BGA) package based on the emerging fan-out wafer-level package (FO-WLP) concept. All the packaging operations are done at the wafer level, and a fan-out area is provided to extend the package size beyond the IC surface area to allow for higher ball counts. The ball pitch is 0.5mm and only one redistribution layer is used for this 217 balls, 8 × 8mm package.
System Plus Consulting’s reverse costing analysis provides for a complete teardown of the XGOLD213 eWLB package including: detailed photo, material analysis, manufacturing process flow, in-depth economical analysis, manufacturing cost breakdown, selling price estimation, and other information. It explains the fan-out package principle, as well as physical analysis and description of the manufacturing process flow.
Sylvain Hallereau compiled the report. Hallereau joined System Plus Consulting in 2000 and is in charge of semiconductors and IC packaging. He has 10 years of experience in reverse costing of semiconductor devices and creation of cost models for integrated circuits. He holds a Master of Science from the Universityof Nantes, France. Contact Hallereau at [email protected]
System Plus Consulting, www.systemplus.fr, specializes in the cost analysis of electronics from semiconductor devices to electronic systems. The report is commercialized by both System Plus Consulting and Yole Développement, www.yole.fr. In 2008, Yole Développement and System Plus Consulting signed a business agreement to broaden the marketing and technological offer of both companies.