Asys plucks DynTest for LED singulation tech

May 10, 2010 – The Asys Group say it has acquired the IP and patents of fellow German firm DynTest Technologies, seeking to apply the company’s wafer singulation technology to high-brightness LEDs.

DynTest’s core technology is in wafer singulation for compound semiconductors and other substrate materials. Asys says it sees particular affinity in LED manufacturing, where DynTest’s technology is "a cost-efficient alternative to the saw-dicing and lasering methods." The company also points to synergies with DynTest’s technology’s improved wafer area utilization, and Asys’ depaneling systems for electronics systems, and metallization process lines for solar cells.

Development of existing prototype machines will be completed and ushered into mass production, with products already slated for release in 2010, the company says. The DynTest product line will be housed in Asys’ solar and new technologies business unit and directed by former DynTest sales/marketing exec Helge Luesebrink.

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