May 10, 2010 – Samsung Electronics says it has developed a new heat dissipating packaging technology for display drivers ICs in high-end TVs.
The new ultralow-temperature chip-on-film ("u-LTOF") packaging setup enhances heat dissipation by minimizing contact thermal resistance between the display driver IC (DDI) package and display panel chassis.
Samsung’s basic LTCOF technology uses a thin-film metal tape to spread heat generated by the DDI, providing a 30% improvement in heat emission vs. conventional chip-on-film packages, the company claims. The new u-LTCOF replaces the thin metal film with a "viscoelastic silicone" possessing a high thermal conductivity, enhancing heat transfer by an additional 20%. Moreover, packages coated with this viscoelastic silicone do not require addition of thin metal films or thermal pads, which saves costs in panel manufacturing.
"We expect the u-LTCOF solution to be applicable to other semiconductor chips such as D-TV system-on-chips (SoCs) that require high-speed processing of increased data," according to Sa-Yoon Kang, VP of Samsung Electronics’ system LSI package development team, in a statement.
The new u-LTCOF package is designed for DDIs in 240Hz full-HD and 3D LED TVs, as well as 60/120Hz mid- to large-size LCD and PDP TVs. Production is slated to begin in 4Q10.