McCredie to Keynote International Wafer-Level Packaging Conference

(June 18, 2010) MINNEAPOLIS, MN — Bradley McCredie, Ph.D., IBM Fellow and VP of IBM Systems and Technology Group, will be the keynote speaker at the 7th Annual International Wafer-Level Packaging Conference, October 11-14, 2010, Santa Clara, CA. Dr. McCredie will present "Technology Scaling, Packaging, and Other Things That Might Put Our Kids Through College."

Dr. Bradley McCredie received his Ph.D. in electrical and computer engineering from the University of Illinois in 1991. He joined IBM and continued his work in packaging focused on IBM’s mainframe systems. In 1996 he began working on POWER based systems. In 2004, Dr. McCredie was appointed to the position of IBM Fellow, IBM’s highest technical position; then in 2009 he was appointed to the position of IBM VP and fellow and is now leading all POWER chip development for IBM systems.

IWLPC, held by SMTA and Chip Scale Review, explores leading-edge design, material, and process technologies focused on wafer-level packaging (WLP) applications. There will be special emphasis on the numerous device and end product applications (RF/wireless, sensors, mixed technology, optoelectronics) that demand wafer-level packaging solutions for integration, cost, and performance requirements.

For more information on IWLPC, contact Melissa Serres at (952) 920-7682 or [email protected]; http://www.iwlpc.com/special_events.cfm#keynote

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.