CEA-Leti building 300mm R&D line dedicated to 3D integration applications

(July 13, 2010) — CEA-Leti has opened a complete 300mm fab extension dedicated to 3D integration applications. The integration line includes lithography, metallization, deep etching, dielectric deposition, wet etching and packaging tools.

Final equipment installations will continue through to the end of this year with an inauguration event planned in January, 2011. Once assembled, the line will be available for Leti’s customers and partners around the world. It will complement Leti’s 3D-integration toolbox, which already includes through-silicon vias (TSV), alignment, bonding, grinding, thinning, planarization, bumping, micro-inserts and design capabilities and mixed-signal IC applications.
“Leti is recognized as a key player in 3D integration R&D and this new line is a vital addition to our continuously expanding 3D capabilities,” said Laurent Malier, CEO of Leti. “It also will enable us to offer heterogeneous integration technologies to customers on 200mm and 300mm wafers.”
CEA is a French research and technology public organization, with activities in four main areas: energy, information technologies, healthcare technologies and defence and security. Within CEA, the Laboratory for Electronics & Information Technology (CEA-Leti) works with companies to increase their competitiveness through technological innovation and transfers. CEA-Leti is focused on micro and nanotechnologies and their applications, from wireless devices and systems, to biology and healthcare or photonics. For more information, visit www.leti.fr


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