ECSI FIBRotools intros MEMS, nano, and HDI electroplaters

(July 15, 2010) — In response to requests from R&D and academic communities, ElectroChemical Systems, Inc. (ECSI) FIBRotools is introducing two products for development of advanced MEMS/nano and high-density interconnect (HDI) fabrication technologies: IKoCLASSIC-SL and IKoCLASSIC-MG.

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Advanced MEMS, nano, and HDI fabrication requires fewer processing steps and improved efficiency and product quality, noted ECSI. The IKoCLASSIC-SL enables electroplating of micro and nano-structures on doped silicon (Si) substrates without the seed layer as a precursor.

Actuators, field generators and micro-motors call for MEMS and nano structures with magnetic capability. IKoCLASSIC-MG enables electroplating of such structures under a magnetic field.

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