EDA in a 3D semiconductor world: Walden Rhines

(July 20, 2010) — In this video interview from SEMICON West 2010, Walden Rhines, Mentor Graphics, discusses 3D technologies. EDA tools need to be extended to meet the needs of 3D — parasitic extraction and timing, place-and-route, and other steps are different with 3D. The tools are evolving for the various 3D technologies. He also touches on lithography evolution.

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Workshop addresses simulating, measuring 3D IC stress using TSVs

SEMATECH and Fraunhofer IZFP hosted a follow-up meeting in conjunction with SEMICON West to evaluate a design-for-manufacturing (DFM) approach to managing stress in 3D interconnects, and to drive consensus and support for these techniques across the industry.

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