EUV news from SEMICON West with Toppan Photomasks

(July 20, 2010) — Franklin Kalk, Toppan Photomasks, comments on the big EUV lithography news annouced at SEMICON West. Technical challenges of EUV remain defect management — finding and fixing defects in masks. Pattern mask inspection may not be ready until 2016.

More on EUV:
SEMICON West: Lithography trends at Sokudo breakfast forum

Imec and ASML demonstrate potential of 193nm immersion lithography

DUV inspection and defect origin analysis for 22nm spacer self-aligned double-patterning

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